Title: Applications of Microelectromechanical Systems (MEMS)
Catalog Description: Fabrication processes for MEMS. Cleanroom standards. Crystal growth: Czochralsky and Float Zone Methods. Lithography. Thermal oxidation of silicon. Wet and dry etching. Thin film deposition: Chamical Vapour Deposition (CVD) and Physical Vapour Deposition (PVD). Surface and bulk micromachining. Electrostatic, piezoelectric, electromagnetic, piezoresistive and thermal actuatuation/detection techniques. Microoptoelectromechanical Systems (MOEMS): microdisplays. Radio frequency MEMS. Microdevices for medical microsystems.
Coordinator: Arda Deniz Yalçınkaya, Assitant Professor of Electrical Engineering
Goals: To introduce the micromechanical device fabrication techniques and applications to the students. To enable the formation of theoretical background in the design of MEMS systems as well as MEMS fabrication process design for a given application.
At the end of this course, students will be able to:
1. Analyze and design various MEMS devices.
2. Design a dedicated fabrication sequence for the implementation of a specific MEMS device.
3. Understand the second order effects in the operation of MEMS devices.
4. Describe the measurement techniques for different MEMS setups.
Textbook: S.D. Senturia , Microsystems Design, 2nd Ed., Kluwer AP, 2001.
Plummer, Deal, Griffin Silicon VLSI Technology, Prentice Hall, 2000.
Prerequisites by Topic:
2. Linear Circuit/System Theory
3. Basic Electronic Circuits
1. Process Technologies, Part-I Modern CMOS/MEMS Technologies, Crystal Growth (1 week)
2. Process Technologies, Part-II Wafer cleaning, Lithography (1 week)
3. Process Technologies, Part-III Thermal oxidation (1 week)
4. Process Technologies, Part-IV Diffusion and Ion implantation (1 week)
5. Process Technologies, Part-V Thin film deposition: Physical and Chemical Vapor Deposition (1 week)
6. Process Technologies, Part-VI Dry and Wet Etching (1 week)
7. Process Integration Surface and Bulk Micromachining (1 week)
8. Actuation/Detection Techniques Part-I Electromagnetic and Electrostatic techniques (2 weeks)
9. Actuation/Detection Techniques Part-II Piezoelectric, Piezoresistive and Thermal techniques (2 weeks)
10. Applications Part-I MOEMS-Microscanners for display applications (1 week)
11. Applications Part-II Radio frequency MEMS and CMOS-MEMS integration (1 week)
12. Left-handed materials for Microwave applications (1 week)
13. Hybrid Microsystems for Medical Applications (1 week)
Course Structure: The class meets for two lectures a week, one consisting of two 50-minute sessions and the
other, just one 50-minute session. 4-5 sets of homework problems are assigned per semester. Each student presents a research paper once (or twice, depending on the registered student number) during the semester There is a CAD design project and an oral final exam.
Computer Resources: Finite element and lumped element analysis using MATLAB-SUGAR, Comsol FEMLAB and Layout design with various CAD tools. These tools will be used in the design phase of the course project.
Laboratory Resources: None
1. Homeworks . . . . . . . . . . . . (25%)
2. Presentations . . . . . . . . . (20%)
3. Course project . . . . . . . . . (25%)
4. Final (Oral) . . . . . . . . . . . . (30%)
Outcome Coverage: This course addresses six of the basic ABET outcomes. These are as follows:
(a) An ability to apply knowledge of mathematics, science, and engineering. The design of microelectromechanical systems involves basic mathematics, physics science, and engineering components. The students should be able to apply simple physics and chemistry knowledge for the understanding of operation of MEMS device as well as applying mathematics in their analysis. The fabrication process of MEMS devices naturally involves engineering skills where the students must evaluate effect of each process step.
(b) An ability to design and conduct experiments as well as analyze and interpret data. The structural mechanics design involves an analysis step where the student must analyze various alternative solutions and must develop experiments to validate and choose from his/her designs. In the computer-based finite element homeworks and design project, this issue is further stressed.
(c) An ability to design a system, component, or process to meet desired needs. The course is basically about designing a proper MEMS solution for a microsystem application. Thus, helping the students to gain the ability to design MEMS devices is an integral part of the course. This issue is stressed in classroom lectures as well homeworks, where the students are expected to design a MEMS device and validate their design with FEA simulation.
(e) An ability to identify, formulate, and solve engineering problems. This issue is stressed in classroom lectures where examples from real-life problems are presented and solved. The homeworks and final project are real applications such as accelerometers, gyroscopes, RF MEMS swithes etc.
(i) A recognition of the need for, and an ability to engage in life-long learning. In classroom lectures, some open ended voluntary problems are stated and the students are encouraged to research on these problems. Furthermore, engaging in membership in various professional societies (such as IEEE) is encouraged. Also, many subjects are taught from a historical perspective to stress the developing nature of the field.
(k) An ability to use the techniques, skills, and modern engineering tools necessary for engineering practice. Students use Comsol FEMLAB, Matlab and SPICE comprehensively in their assignments.
Design Experience Considerations:
Engineering standards and realistic constraints: Students are given realistic specifications as well as simulation models of real components to make actual engineering designs.
Economic In the design examples of the homeworks, starting substrate, number of thermal processing steps, overall cost of the fabrication technology are set as optimization parameters.
Prepared By: Arda Deniz Yalçınkaya